01
Statistical Yield Modeling for 3D-Stacked Hybrid-Bonded Systems
A stage-aware framework for D2D and W2W stacks that brings overlay, contamination, Cu recess, ESD, TSV defects, and thermomechanical warpage into one statistical view of yield.
Electrical & Computer Engineering
Ph.D. Student · University of Minnesota Twin Cities
Heterogeneous integrationmodeledas a system.
I study heterogeneous integration through system–technology co-optimization, with a current focus on power delivery network modeling and system-level optimization.
- Modeling & Simulation
- System-Level Optimization
- Hybrid Bonding
- 2.5D/3D Integration
- Design Automation
Research built for real constraints.
02
Yield-Aware I/O Planning for Hybrid-Bonded Chiplets
A layout-aware I/O planning framework that jointly models ESD, particle contamination, overlay variation, and thermomechanical failure for 2.5D and 3D chiplet systems.
Improved bonding yield by up to 19.9 percentage points on HBM4 and million-bump benchmarks without increasing die area.
My academic path began with communication engineering and its foundations in signal and image processing, expanded into integrated circuits, chip architecture, and AI hardware, and now centers on heterogeneous integration at the system level.
University of Minnesota Twin Cities
Ph.D. in Electrical and Computer Engineering
Minneapolis, Minnesota
Research in heterogeneous integration, with an emphasis on power-delivery-network modeling and system-level co-optimization.
University of California, Los Angeles
M.S. in Electrical and Computer Engineering · GPA 3.76/4.0
Los Angeles, California
Graduate study in integrated circuits, chip architecture, and AI hardware, with research spanning hybrid bonding and 2.5D/3D integration.
Xidian University & Heriot-Watt University
B.Eng. in Communication Engineering · GPA 3.9/4.0
China & United Kingdom
Foundations in communication systems, signal processing, and image processing.
Awards & honors
- Deputy Principal's Award
- Overseas Scholarship for Outstanding Graduates
- Third-Class Scholarship
I am now a Ph.D. student at the University of Minnesota, working with Prof. Sachin S. Sapatnekar on research in heterogeneous integration.
Previously, I completed my master's degree at UCLA, where I conducted research in the NanoCAD Lab with Prof. Puneet Gupta.
Outside my day-to-day doctoral research, I enjoy playing basketball, working out, skiing, surfing, and traveling.
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