Electrical & Computer Engineering
I study yield, reliability, and design automation for advanced 2.5D/3D integrated systems.
Ph.D. Student · University of Minnesota
01 / Selected work
My work connects statistical modeling, physical reliability, and optimization to make advanced integration more predictable.
A stage-aware framework for D2D and W2W stacks that brings overlay, contamination, Cu recess, ESD, TSV defects, and thermomechanical warpage into one statistical view of yield.
Validated analytical mechanics against 300 ANSYS cases with 0.108 µm mean absolute error, without empirical fitting.
A layout-aware I/O planning framework that jointly models ESD, particle contamination, overlay variation, and thermomechanical failure for 2.5D and 3D chiplet systems.
Improved bonding yield by up to 19.9 percentage points on HBM4 and million-bump benchmarks without increasing die area.